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- Manufacturer:
- Model:SAC305-0.5mm
- SKU:
- Available:1 pcs.
Lead Free solder SAC305 with SD-82 flux, 0,5mm
Solder with SD-82 flux is used both for soldering new and for repairing printed circuit assemblies that already have a thick oxide film and / or oily deposits on the surface of the soldered joints. SD-82 grade flux is a high activity flux and is classified by IPC J-STD-004B as ROL1. This flux is compatible with all existing finishes of PCBs and components, flux residues after soldering are non-corrosive and can be left on the board. If it is necessary to cover the PCB with a protective conformal coating, the flux residues can be removed both with solvents and with saponifying materials by hand, jet or ultrasonic cleaning. The properties of the flux make it possible to use it both with traditional tin-lead alloys and with lead-free alloys.
Wire diameter: 0,5 mm
Minimum purity raw materials used: 99.9% uptime
Melting point: 183 °C to 190°C
Flux content: 2.5 %
Working temperature: 320°C to 420°C
Chemical composition of standard tin alloys
Lead Free solder SAC305
|
Component |
Sn |
Ag |
Cu |
Pb |
Sb |
Bi |
Zn |
Fe |
Al |
As |
Cd |
|
Quantity,% |
Else |
3 ± 0,2 |
0,5 ± 0,1 |
0,05 |
0.5 |
0,05 |
0,02 |
0,008 |
0,005 |
0,025 |
0,005 |
Characteristics SD-82 flux
|
Parameter |
Value |
|
Flux classification under IPC J-STD-004B |
ROL1 |
|
Flux residues after soldering |
Clear and dry |
|
The flux spreading, % |
75 |
|
The content of halides, % |
0,2 |
|
Surface resistance test |
Passed |
|
Test on a copper plate |
No visible corrosion |
|
Test on a copper mirror |
Passe |
