Solders with silver and flux

Solder with silver and flux is used for mock-up, in the production of small series and for the repair of electronic and electromechanical devices.

The tin with flux contains fluxes of various activities. For the production of new products, if there is no need to remove impurities or if minor impurities need to be cleaned from the surfaces of soldered elements, fluxes with low activity are used, according to the classification of the IPC standard J-STD-004B to ROL0 (or REL0). To carry out repairs of electronics or electromechanics, tin with tonics are used with increased activity to remove thick oxidized coatings or oil contamination from the brazed surfaces, such fluxes are classified as ROL1 (REL1). Tin with ROM1 (REM1) flux is used during assembly or renovation of components that are poorly susceptible to soldering, for example copper pipes, plates, earth bars, etc. Fluxes with increased ROL1 (REL1) or ROM1 (REM1) activity are also used for brazing solder-resistant materials such as bronze or nickel. A specialized inorganic-based flux has been developed for soldering aluminum surfaces and is classified as INH1 according to IPC J-STD-004B.