Wire solder with silver and SD-82 flux, 1,0 mm

Wire solder Sn62Pb36Ag2 with silver and SD-82 flux, 1,0 mm

Wire diameter: 1.0 mm

Minimum purity of the raw materials used: 99.9%
Melting point: 183 ° C to 190 ° C
Flux content: 1.5%
Working temperature: 320 ° C to 420 ° C

Tubular solders with SD-82 no-clean flux have increased wettability on difficult-to-solder surfaces such as OSP, Ni, Zn, nickel silver, as well as dirty surfaces. Rosin is included in the composition of the SD-82 flux to increase the flowability of the solder on the surfaces to be soldered. SD-82 flux contains a small amount of halogens and is therefore classified by IPC J-STD-004B as ROL1.

Solder with SD-82 flux is used both for soldering new and for repairing printed circuit assemblies that already have a thick oxide film and / or oily deposits on the surface of the soldered joints. SD-82 grade flux is a high activity flux and is classified by IPC J-STD-004B as ROL1. This flux is compatible with all existing finishes of PCBs and components, flux residues after soldering are non-corrosive and can be left on the board. If it is necessary to cover the PCB with a protective conformal coating, the flux residues can be removed both with solvents and with saponifying materials by hand, jet or ultrasonic cleaning. The properties of the flux make it possible to use it both with traditional tin-lead alloys and with lead-free alloys.